Titanium nitride (TiN) is a ceramic steel compound composed of titanium and nitrogen, generally offering a captivating golden-yellow color, while its powder state may appear yellow-brown, or black. TiN has a high melting factor of about 2950 ° C and exhibits exceptional warmth resistance. At the same time, it likewise has a Vickers solidity of approximately 2000-2500 HV, making it an excellent wear-resistant material.
Revolutionary progress of TiN slim film.
(Titanium Nitride)
A notice launched on April 12, 2024, mentioned that titanium nitride movies produced by ion deposition sputtering technology can lower their typical resistivity by about 40% while minimizing the surface area roughness of the movie by regarding 45%. This low insusceptibility and smooth TiN film is incredibly beneficial in the areas of semiconductors and electronic products since it has excellent conductivity and mechanical stamina and can supply specific oxidation and deterioration resistance.
Qualities and Applications of TiN Thin Films:
Improved conductivity: The substantial decrease in resistivity of TiN slim films suggests a considerable improvement in their conductivity. This is crucial for integrated circuits (ICs), microprocessors, and other microelectronic devices that require low-resistance connections. Reduced resistance can lower energy loss in signal transmission, thus boosting circuit efficiency and rate.
Improving movie top quality: The significant decrease in surface roughness makes the movie surface smoother, which not only boosts the aesthetic appearance of the product yet, more notably, strengthens the physical and chemical stability of the film. A smooth surface can lower contact resistance, which is crucial for producing high-performance digital tools.
Expanding application scope: Low-impedance smooth TiN film can be commonly made use of in numerous gadgets:
Metalization layer: As a metallization layer in semiconductor devices, it makes certain the efficient flow of existing and attaches various circuit components.
Obstacle layer: stops diffusion between different metal layers and preserves the purity and performance of each layer material.
Warmth dissipation layer: Making use of the high thermal conductivity of TiN to assist dissipate warm from devices, staying clear of efficiency degradation or damage triggered by overheating.
Decor and safety layer: used as an attractive layer and scratch-resistant safety layer on digital device housings or watches and other products.
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